Cards and assemblies with user interfaces

ABSTRACT

Laminated cards with user interfaces are provided. The user interfaces can have enhanced tactile feel. In one embodiment, a card may be constructed to have a dual-layer user interface. In another embodiment, a card may be constructed to include a support structure. In yet another embodiment, a card may include a relatively soft material that covers at least a portion of the user interface. In yet another embodiment, a card may include a user interface that is fluidically coupled to a bladder. In a further embodiment, a card can include any combination of a user interface, which may be a dual-layer user interface, a support structure, a soft material that at least partially covers a user interface, and a bladder.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 61/166,909 filed on Apr. 6, 2009, 61/220,501 filed onJun. 25, 2009, 61/234,406 filed on Aug. 17, 2009, and 61/247,143 filedon Sep. 30, 2009, all of which are hereby incorporated by referenceherein in their entirety.

BACKGROUND OF THE INVENTION

This relates to laminated cards with user interfaces.

Powered cards or electronic cards that include components such as abattery, a microprocessor, and other circuitry may be assembled to havesimilar dimensions to credit or debit cards or other cards which mayinclude a magnetic stripe, for example. Some of these cards may includebuttons, however if the cards are laminated, the buttons may not workreliably or may lack a tactile feel.

What is needed is a laminated card having at least one user interfacethat functions reliably and can provide a suitable tactile feel.

SUMMARY OF THE INVENTION

A laminated card or assembly having at least one user interface isprovided. The user interface may be mounted on a circuit board such as aflexible printed circuit board. In one embodiment, the user interfacemay be a dual-layer user interface. The dual-layer user interface mayinclude a first element mounted to a circuit board and has a portionoperative to engage an electrical contact on the board during an inputevent. The dual-layer user interface may include a second elementmounted to the board and is operative to engage a surface of the firstelement during the input event.

In another embodiment, a laminated card or an assembly may include auser interface that is supported by a structural support. The structuralsupport may be mounted to a circuit board on the side opposite of theside to which the user interface is mounted. The structural support maymitigate deflection of the circuit board during the input event bydistributing force applied thereto.

In another embodiment, a laminated card or an assembly may include auser interface that is at least partially covered by a material. Thismaterial may have a durometer value less than the durometer value of alamination material (e.g., a material used during a lamination process)that may be fixed to the material that is at least partially coveringthe user interface. This permits the material to flex relative to thelamination material. For example, the material may buttress the userinterface, yet yield to the lamination material during an input event,thereby enabling the lamination material to deflect the user interface.

In yet another embodiment a laminated card or an assembly may include auser interface and a bladder. The user interface and the bladder may befluidically coupled such that, during an input event, gas displaced bythe user interface is routed to the bladder. The bladder may be anotheruser interface, a false user interface, a cavity disposed on the board,a cavity disposed in the structural support, or any other suitablestructure.

In a further embodiment, a card can include any combination of a userinterface, which may be a dual-layer user interface, a supportstructure, a durometer-specific material that at least partially coversa user interface, and a bladder. Any one of these combinations may alsoinclude an adhesive layer that covers the user interface. This adhesivelayer may hold the user interface in place on the flexible circuitboard. The adhesive layer may also provide an air-tight seal thatprevents or substantially limits egress of any gas from the userinterface during, for example, a lamination process. The adhesive layermay be a pressure sensitive adhesive that is UV or catalyst curable. Inembodiments that have an adhesive layer and the durometer-specificmaterial, the durometer-specific material may be fixed to a top surfaceof the adhesive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The principles and advantages of the present invention can be moreclearly understood from the following detailed description considered inconjunction with the following drawings, in which the same referencenumerals denote the same structural elements throughout, and in which:

FIGS. 1-2 show illustrations of different card embodiments;

FIG. 3 shows illustrative cross-sectional views of embodiments includinga dual-layer user interface;

FIG. 4 shows illustrative cross-sectional views of embodiments includinga support structure;

FIGS. 5A-C show illustrative top views of embodiments with differinguser interface and support structure arrangements;

FIG. 6 shows illustrative cross-sectional views of embodiments includinga user interface and a material that at least partially covers the userinterface;

FIG. 7 shows illustrative cross-sectional views of embodiments includinga user interface, a support structure, and a material that at leastpartially covers the user interface;

FIGS. 8-15 show illustration of different assemblies constructed for usein laminated cards in accordance with embodiments of the invention;

FIG. 16-19 show illustrations of cards or assemblies including a userinterface and a bladder in accordance with embodiments of the invention;

FIG. 20 is a flowchart illustrating steps for constructing embodimentsof the invention; and

FIG. 21 is an illustrative block diagram of a system for constructingembodiments of the invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows card 100 that may include, for example, a dynamic numberthat may be entirely, or partially, displayed via display 112. A dynamicnumber may include a permanent portion such as, for example, permanentportion 111. Permanent portion 111 may be printed as well as embossed orlaser etched on card 100. Multiple displays may be provided on a card.For example, display 113 may be utilized to display a dynamic code suchas a dynamic security code. Display 125 may also be provided to displaylogos, barcodes, as well as multiple lines of information. A display maybe a bi-stable display or non bi-stable display. Permanent information120 may also be included and may include information such as informationspecific to a user (e.g., a user's name or username) or informationspecific to a card (e.g., a card issue date and/or a card expirationdate). Card 100 may include one or more buttons such as buttons 130-134.Such buttons may be mechanical buttons, capacitive buttons, or acombination or mechanical and capacitive buttons.

Architecture 150 may be utilized with any card. Architecture 150 mayinclude processor 120. Processor 120 may have on-board memory forstoring information (e.g., application code). Any number of componentsmay communicate to processor 120 and/or receive communications fromprocessor 120. For example, one or more displays (e.g., display 140) maybe coupled to processor 120. Persons skilled in the art will appreciatethat components may be placed between particular components andprocessor 120. For example, a display driver circuit may be coupledbetween display 140 and processor 120. Memory 142 may be coupled toprocessor 120. Memory 142 may include data that is unique to aparticular card.

Any number of reader communication devices may be included inarchitecture 150. For example, IC chip 150 may be included tocommunicate information to an IC chip reader. IC chip 150 may be, forexample, an EMV chip. As per another example, RFID 151 may be includedto communicate information to an RFID reader. A magnetic stripecommunications device may also be included to communicate information toa magnetic stripe reader. Such a magnetic stripe communications devicemay provide electromagnetic signals to a magnetic stripe reader.Different electromagnetic signals may be communicated to a magneticstripe reader to provide different tracks of data. For example,electromagnetic field generators 170, 180, and 185 may be included tocommunicate separate tracks of information to a magnetic stripe reader.Such electromagnetic field generators may include a coil wrapped aroundone or more materials (e.g., a soft-magnetic material and a non-magneticmaterial). Each electromagnetic field generator may communicateinformation serially to a receiver of a magnetic stripe reader forparticular magnetic stripe track. Read-head detectors 171 and 172 may beutilized to sense the presence of a magnetic stripe reader (e.g., aread-head housing of a magnetic stripe reader). This sensed informationmay be communicated to processor 120 to cause processor 120 tocommunicate information serially from electromagnetic generators 170,180, and 185 to magnetic stripe track receivers in a read-head housingof a magnetic stripe reader. Accordingly, a magnetic stripecommunications device may change the information communicated to amagnetic stripe reader at any time. Processor 120 may, for example,communicate user-specific and card-specific information through RFID151, IC chip 150, and electromagnetic generators 170, 180, and 185 tocard readers coupled to remote information processing servers (e.g.,purchase authorization servers). Driving circuitry 141 may be utilizedby processor 120, for example, to control electromagnetic generators170, 180, and 185.

FIG. 2 shows illustrative cross-sectional view of card 200. Card 200 maybe, for example, between 25 and 40 thousandths of an inch thick (e.g.,approximately between 30 and 33 thousandths of an inch thick. Card 200may include, for example, layer 210. Layer 210 may be a polymer, such asa polyethelene terephthalate. Similarly, layer 215 may be included as apolymer, such as polyethelene terephthalate. Layers 210 and 215 may be alaminate material or a composite laminate material. During constructionof card 200, an electronics package circuitry (e.g., board 212, whichmay be a dynamic magnetic communications device, processor 216, display217, buttons 218, additional circuitry 219, board 213, and battery 214)may be fixed (e.g., glued) to layer 215, material 211 may be injectedonto the electronics circuitry package, and layer 210 may be applied tomaterial 211. Material 211 may be formed from one or morepolyurethane-based or silicon-based substances. Material 211 may be asubstance that changes its physical state (e.g., changes from a liquidsubstance to a solid substance) when subjected to one or morepredetermined conditions (e.g., heat, pressure, light, or a combinationthereof) for a predetermined period of time.

To fabricate a card that is approximately 33 thousandths of an inchthick, for example, layers 215 and 210 may be approximately 5 to 7thousandths of an inch thick (e.g., 5 thousandths of an inch thick). Anelectronics package may have a maximum thickness ranging betweenapproximately 10-20 thousandths of an inch, between approximately 12-18thousandths of an inch, between approximately 14-18 thousandths of aninch, or approximately 16 thousandths of an inch. Material 211 may havea thickness that ranges between approximately 1-16 thousands of an inch,between 3-10 thousands of an inch, or approximately 7 thousandths of aninch. The thickness of material 211 may vary depending on a heightprofile of the electronics package. Thus, for portions of the electronicpackage having a relatively tall height (e.g., 16 mils), the thicknessof material 211 residing on that portion may be less thick that aportion of material 211 residing on a portion of the electronics packagehaving relatively short height (e.g., 9 mils). The combined thickness ofthe electronic package and material 211 may range between approximately8-26 mils, 14-24 mils, 16-23 mils, 18-22 mils, 20-23 mils, 16-20 mils,19 mils, 20 mils, 21, mils, 22 mils, or 23 mils. If desired, aprotective layer may be placed over layers 210 and 215. Such aprotective layer may be between approximately 0.5 and 2 thousands of aninch thick or 1.5 thousandths of an inch thick.

In one embodiment, a card can be constructed so that the combinedthickness of the electronics package and laminate 211 is approximately21 mils and that the combined thickness of layers 210 and 215 isapproximately 10 mils, resulting in a card having a thickness ofapproximately 31 mils. Persons skilled in the art will also appreciatethat an injection molding process of a substance may allow thatsubstance to fill into the groove and gaps of an electronics packagesuch that the laminate may reside, for example, between components of anelectronics package.

Card 200 may include an electronics package that includes, for example,board 212, which may be a dynamic magnetic communications device,processor 216, display 217, buttons 218, additional circuitry 219, board213, and battery 214. Magnetic material may be, for example, provided aspart of an assembled board 212 or fixed to the top of board 212. Board213 may include, for example, capacitive read-head detectors placedabout board 212. Battery 214 may be any type of battery, such as, forexample, a flexible lithium polymer battery. Circuitry 219 may include,for example, one or more driver circuits (e.g., for a magneticcommunications device), RFIDs, IC chips, light sensors and lightreceivers (e.g., for sending and communicating data via opticalinformation signals), sound sensors and sound receivers, or any othercomponent or circuitry for card 200.

Card 250 may be provided and may include, for example, exterior layers251 and 254, board 253, board 260, processor 255, display 256, buttons257, circuitry 258, and battery 259. Persons skilled in the art willappreciate that read-head detectors may be included, for example onboard 253 or a different board (e.g., a board provided between board 253and layer 254). Material 252 may be disposed between layers 251 and 254,covering the circuitry and permeating voids existing between circuitcomponents.

FIG. 3 shows card 300, which may include layer 301, material 302, layer305, other circuitry 306, board 310, and dual-layer user interface 320.Other circuitry 306 can represent, in the abstract, all other circuitry(e.g., display, processor, battery, etc.) that may be included in acard. An adhesive layer (not shown) may cover board 310 and userinterface 320.

The adhesive layer is separate and distinct from material 302 and may beused to hold user interface 320 in place during a card laminationprocess. The adhesive layer may be a pressure sensitive adhesive that isUV or catalyst curable. The adhesive layer may prevent or at leastsubstantially limit outgassing of any gas contained within userinterface 320 when other circuitry 306, board 310, and user interface320 are subjected to conditions (e.g., a lamination process) that mayapply pressure thereto. Limiting or eliminating such outgassing mayprevent formation of a vacuum, which if present, could adversely affectuser interface performance. For example, presence of a vacuum couldcause board 310 to flex up towards user interface 320. In addition,because the conditions that apply pressure to user interface 320 maycause it to deflect, the presence of a vacuum could also prevent userinterface 320 from returning to a less deflected state.

Board 310 can be a flexible printed circuit board. Board 310 may have athickness ranging between 0.5 and 3 Mils, or may have a thickness of 1or 2 mils. The flexibility of board 310 may vary, yet exhibitsflexibility sufficient for enabling card 300 to flex like a conventionalcredit card (i.e., a card having a conventional magnetic stripe). Thecomposition of board 310 may vary. For example, in one embodiment, board310 can be a Kevlar based flexible printed circuit board. In anotherembodiment, board 310 can be a conventional circuit board.

Board 310 may have mounted thereon dual-layer user interface 320.Dual-layer user interface 320 is operative to receive input events froma user (e.g., a pinch of fingers or a press of a finger). On receipt ofan input event, a portion (e.g., an inner layer) of user interfaceelement contacts a footprint or trace (not shown) on board 310.

Dual-layer user interface 320 can be constructed to have a variety ofdifferent shapes and construction configurations. Each configuration caninclude two layers: an inner layer and an outer layer. The inner layermay have a portion that is permanently electrically coupled to afootprint and another portion that engages a footprint in response to aninput event. When the other portion engages the footprint, an electricalconnection can be formed.

The outer layer may cover all or a portion of the surface of the innerlayer. During an input event, a bottom surface of the outer layer mayengage a top surface of the inner layer, causing the inner layer todepress and contact the footprint. A gap separation may exist betweenthe inner and outer layers when in a relaxed state (i.e., notexperiencing an input event). The gap separation may be such that theinner layer is permitted to jiggle and return to its relaxed state afteran input event without touching the outer layer. In one embodiment, thegap separation may vary across a width of user interface 320. Forexample, the gap separation at the center may be maintained at adistance less than the gap separation at other locations. In anotherembodiment, the gap separation may be substantially uniform across thewidth. In another embodiment, the gap separation between the portion ofthe outer layer that interfaces with the inner layer during an inputevent may be maintained at a distance ranging between 0.25 to 1.25 mils,or about 1 mil.

An outer edge or edges of the outer layer may be mounted directly toboard 310 or to a layer residing on top of board 310. In one embodiment,the outer edge or edges may extend beyond the edge or edges of the innerlayer. In another embodiment, the outer edge or edges of the outer layermay coincide with the outer edge or edges of the inner layer.

In one embodiment, user interface 320 may include two dome switches bothconcentrically mounted about the same axis on board 310. The domeswitches may have different dimensions. For example, the inner layer mayhave a smaller dimension (e.g., diameter) than the outer layer. Anysuitably shaped dome switch may be used. For example, oblong, circle,triangle, or star shaped domes may be used.

During a lamination process such as a reaction in mold laminationprocess, material 302 is applied, under pressure, in a gaseous or liquidstate and is later cured. The dual layer structure of user interface320, particularly, the outer layer can mitigate application of pressureto user interface 320 during the card lamination process. This may serveto maintain a tactile feel during user input events and can betterenable user interface to function properly and reliably. By way ofcomparison, a single layer user interface can be crushed orsubstantially flattened under the pressure during the laminationprocess, and thus is unable to yield a tactile feel, and in some cases,renders the user interface inoperable.

Assembly 310 of FIG. 3 shows a cross-sectional view of a user interfaceassembly. Assembly 310 may include board 352 and dual-layer userinterface 360. An adhesive (not shown) may be provided to hold userinterface 360 in place. Assembly 310 may be assembled as a subassemblyfor later inclusion in a card. For example, assembly 310 may bemanufactured at a first facility and shipped to a second facility whereit can be used as a part in a card assembly line.

Dual-layer user interface 360 may be any dual layer structure operativeto receive and register an input event. User interface 360 may embodyaspects of user interface 320, discussed above, or aspects of other userinterfaces discussed herein.

FIG. 4 shows a cross-sectional view of card 400. Card 400 can includelayer 401, material 402, layer 403, board 410, user interface 420, andsupport structure 430. Card 400 may be similar to card 300 of FIG. 3,except for the addition of support structure 430. Moreover, an adhesivelayer, similar to the adhesive layer discussed above, may be provided tocover user interface 420 and at least a portion of board 410. Supportstructure 430 may be affixed to a bottom surface of board 410. Supportstructure 430 may be constructed from a material having sufficientstructural strength to distribute force applied thereto to preventsubstantial deflection of board 410 or to at least mitigate deflectionof board 410. Preventing or mitigating deflection of board 410 furtherpromotes a tactile feel of user interface 420 during an input event. Inone embodiment, support structure 430 may be a metal (e.g., steel,aluminum, or alloy) plate. In another embodiment, support structure 430may be a non-magnetic material such as carbon fiber, plastic, or glass.

Support structure 430 may be sized according to any suitable dimension.For example, support structure 430 may be sized to cover a portion orthe entirety of the bottom surface of board 410. As another example,support structure may exceed the area of board 410. As yet anotherexample, support structure 430 may be sized to occupy an area similarto, or slightly larger than, the area occupied by user interface 420. Insome embodiments, where multiple user interfaces are provided, multiplesupport structures 430 may adhere to board 410. If desired, each ofthose support structures 430 may be sized for each user interface, asillustrated in FIG. 5A. Alternatively, those support structures 430 maybe sized to cover all the user interfaces, as illustrated in FIGS. 5Band 5C.

Support structure 430 may have a thickness ranging between 0.25 to 4mils or between 1 to 3 mils. In some embodiments, support structure 430may have a thickness of about 1 mil, about 1.25 mils, about 1.5 mils,about 2 mils, or about 3 mils.

Referring back to FIG. 4, an illustrative cross-sectional view ofassembly 450 is provided. Assembly 450, similar to assembly 310 (of FIG.3) may be a stand-alone sub-assembly that may be later incorporated intoa card during, for example, a final card assembly step. Assembly 450 caninclude board 452, user interface element 460, and support structure470. An adhesive layer (not shown) may also be included. Board 410 maybe any suitable flexible circuit board. User interface 460 may be a duallayer user interface such as those discussed herein or a single layeruser interface (e.g., a dome switch). Support structure 470 may be anysuitable support structure such as those discussed herein.

FIG. 6 shows an illustrative cross-sectional view of card 600. Card 600can include layer 601, material 602, layer 603, board 610, userinterface 620, and material 622. An adhesive layer (not shown) may alsobe included and may cover user interface 620 and at least a portion ofboard 610. Material 622 may be disposed on top of the adhesive layer(not shown). Board 610 may be a flexible printed circuit board such asthose discussed herein. User interface 620 may be a single or dual layeruser interface.

Material 622 can be any suitable material that covers at least a portionof user interface 620. If the adhesive layer is present, material 622may adhere direct to that layer. If not present, material 622 maydirectly adhere to user interface 620. Material 622 may be apolyurethane based material or a silicone based material. In someembodiments, material 622 may cover user interface 620 and board 610, orany other suitable structure. Material 622 may be disposed such that itcircumvents and partially covers user interface 620, thereby exposingthe uncovered adhesive portion to direct contact with material 602. Inanother embodiment, material 622 may entirely encapsulate user interface620 such that material 602 does not directly contact the adhesive layercovering user interface 620. Several different arrangements of material622 are shown in FIGS. 8-15.

Material 622 can promote the tactile feel of an input event. Material622 may buttress user interface 620. For example, material 622 mayprovide sidewall support that limits lateral movement and promotesvertical movement of user interface 620. In one embodiment, for example,during an input event, deflection of user interface 620 is concentratedin the portion (of interface 620) that is not covered by material 622.Thus, the portion of user interface 620 that is more closely connectedto material 602 may be more susceptible to deflection or verticalmovement than those portions less closely connected with material 602,as material 622 is buttressing those portions it is covering.Accordingly, by concentrating deflection, the tactile feel of userinterface 620 may be improved.

Material 622 may have a predetermined durometer that is different thanthe durometer of other materials (e.g., material 602) in card 600.Durometer is a measure of the hardness of a material. For example, inone embodiment, the durometer of material 622 is less than the durometerof material 602. In this embodiment, material 622 may yield to material602 during an input event. The difference in hardness between materials602 and 622 can promote the tactile feel of an input event. In oneembodiment, material 622 may have durometer value according to the Ascale.

Assembly 650, which is shown as a cross-sectional view is provided inFIG. 6. Assembly 650 may be a stand-alone sub-assembly that may be laterincorporated into a card during, for example, a final card assemblystep. Assembly 650 can include board 652, adhesive layer 654, userinterface 660, and material 662. Board 652 may be any suitable flexiblecircuit board. Adhesive layer 652 may cover user interface 660 and aportion of, or all of, board 610. User interface 660 may be a dual layeruser interface such as those discussed herein or a single layer userinterface (e.g., a dome switch). Material 662 may cover at least aportion of user interface 660, and for those portions it cover, it mayadhere to the adhesive layer.

FIG. 7 shows an illustrative cross-sectional view of card 700. Card 700can include layer 701, material 702, layer 703, board 710, userinterface 720, material 722, an adhesive layer (not shown), and supportstructure 730. Card 700 can include all the elements of card 600 (ofFIG. 6) with the addition of support structure 730. Thus, card 700benefits from the advantages provided by both material 722 and supportstructure 730. User interface 720 can be a single or dual layer userinterface.

FIG. 7 also shows illustrative cross-sectional view of assembly 750.Assembly 750 can be a sub-assembly that can be used as a part inassembling a card such as card 700. Assembly 750 can include board 752,adhesive layer (not shown), user interface 760, material 762, andsupport structure 770.

FIGS. 8-15 show many different user interface and materialconfigurations that may be constructed for use in a card. Eachembodiment shown in FIGS. 8-15 includes a board, a user interface, andmaterial (e.g., user interface support material). Support structures, ifincluded, are optional. None of FIGS. 8-15 show an adhesive layer, butsuch an adhesive layer may exist, and such adhesive layer may completelycover the user interface(s) and at least a portion of the board. It isunderstood that if any material (i.e., user interface buttressingmaterial) is present, it covers the adhesive.

FIG. 8 shows an assembly 800 including a dual-layer user interface 820partially supported by material 830. User interface 820 may includeforce concentration structures 825. Force concentration structures 825may be operable to concentrate application of an applied force torespective predetermined locations. As shown, upper structure 825 mayapply a concentrated force to the inner layer of user interface 820 andlower structure 825 may apply a concentrated force to board 810. In someembodiments, both layers of user interface 820 may include a forceconcentration structure. In other embodiments, only one of the layersmay include a force concentration structure. For example, the outerlayer may include a force concentration structure, whereas the innerlayer may not. In another example, the inner layer may include a forceconcentration structure, and the outer layer may not.

Force concentration structure 825 may be provided in any suitable shape.For example, the structure may have a pointed tip, wedge-shaped tip, ora rounded tip that protrudes from a layer of user interface 820. Forceconcentration structure 825 may be integrated with a layer of userinterface 820. The shape of a force concentration structure for an innerlayer may be different than a force concentration structure for an outerlayer of user interface 820. Force concentration structure 825 may beconstructed from the same material as a layer of user interface 820, ormay be electrically conductive.

Force concentration structure 825 may be constructed to provide apredetermined gap separation between the outer and inner layers whenuser interface 820 is in a relaxed state. In some embodiments, the gapseparation that exists between the portions of the inner and outerlayers that interface with each other during an input event may requirea relatively tight tolerance. Force concentration structure 825 mayassist in meeting that tolerance.

FIG. 9 shows an assembly 900 that can include board 910, user interface920, which has incorporated therein force concentration structure 925,material 930, and support structure 940. Assembly 900 can furtherinclude footprints 912, which are provided on board 910. Footprints 912may be traces printed or etched into board 910. In embodiments in whichuser interface 920 resembles or is a dome switch, footprints 912 mayhave inner and outer footprints. As such, the edge of user interface 920may be electrically coupled to the outer footprint. During an inputevent, force concentration structure 925 may form an electricalconnection with the inner footprint.

As shown in FIG. 9, user interface 920 is a single layer user interface.Material 930 covers a portion of the outer surface of user interface 920and a portion of board 910.

FIG. 10 shows assembly 1000 that can include board 1010, footprints1012, user interface 1020, which includes force concentration structures1025, and material 1030. User interface 1020 is a dual-layer userinterface. In this embodiment, the outer layer extends beyond the outerfootprint 1012, as shown. Material 1030 can cover a portion of the outerlayer of user interface 1020 and a portion of board 1010. In embodimentswhere both layers are mounted to the same plane (e.g., top surface ofboard 1010) or substantially co-planer planes, the outer layer may havea larger dimension (e.g., radial dimension) than the inner layer.

FIG. 11 shows illustrative top and cross-sectional views of assembly1100. Assembly 1100 can include board 1110, footprints 1112, userinterface 1120, with force concentration structures 1125, material 1130,and support structure 1140. Assembly 1100 may further include stepstructure 1114 provided on board 1110. An adhesive layer (not shown) maycover user interface 1120 and step structure 1114. Step structure 1114may raise the outer layer of user interface 1120 a predetermined heightrelative to the inner layer. In addition, step structure 1114 may assistin securing the inner layer in place on board 1110. Material 1130 mayadhere to the outer layer of user interface 1120 and step structure1114. In some embodiments, material 1130 may adhere to the outer layer,step structure 1114, and board 1110.

Step structure 1114 may be constructed from any suitable material. Forexample, step structure 1114 may be a polyurethane material, an injectedmolded plastic, or a polyester material.

The top view shows step structure 1114 disposed on board 1110 and thatmaterial 1130 is disposed as a ring around the outer layer of userinterface 1120. The inner layer is shown with hidden lines.

FIG. 12 shows assembly 1200 that can include board 1210, footprints1212, dual layer user interface 1220, with force concentrationstructures 1225, material 1230, and support structure 1240. Assembly1200 may also include multi-tiered step structure 1216. An adhesivelayer (not shown) may cover user interface 1220 and step structure 1216.Step structure 1216 may include at least two tiers. These tiers may becalled a bottom tier and a top tier. The top tier may raise the outerlayer of user interface 1220 a predetermined height relative to theinner layer. The bottom tier may be used to assist in securing the innerlayer of user interface 1220 in place. Material 1230 may cover the outerlayer of user interface 1220 and the top tier of tier structure 1216.

FIG. 13 shows assembly 1300 that can include integrated dual-layer userinterface 1320. Integrated dual-layer user interface 1320 combines boththe inner and outer layers in a single integrated component. Thiseliminates a need for step structures or differently sized layers inorder to maintain a desired gap separation between the layers. Userinterface 1320 may include one or two force concentration structures.The outer and inner layers may be coupled together, for example, at theedge, which may be mounted to footprint 1312. Material 1330 may adhereto user interface 1320 and board 1310.

FIG. 14 shows assembly 1400 that can include user interface 1420 that iscompletely covered by material 1430. FIG. 15 shows assembly 1500 thatcan include user interface 1520 that is substantially covered bymaterial 1530, however leaves a relatively small portion of userinterface 1520 exposed. FIGS. 14 and 15 illustrate that materialcoverage of the user interface may vary (e.g., from minimalencapsulation to full encapsulation).

In some embodiments, the material composition may vary. For example, thematerial may include materials having two different durometer values,both of which may be less than the durometer value of other material(e.g., lamination adhesive) in the card.

User interfaces incorporated into cards may be contained in a closedsystem that does not vent to atmosphere or the ambient environment.Thus, in such a card, when a user interface is depressed, gas containedin or about the interface may be displaced. Absent any relief for thedisplaced gas, the tactile feel may be muted or the user interface maynot function as desired. Incorporation of a bladder may provide relieffor the gas. FIGS. 16-20 show different illustrative embodiments havinga bladder for receiving gas displaced by a user interface during aninput event.

FIG. 16 shows a cross-sectional view of card 1600 having a bladder. Card1600 can include layer 1601, material 1602, layer 1603, board 1610, userinterface 1620, material 1630, bladder 1640, and support structure 1650.Other circuitry and components may be included, but are not shown toavoid overcrowding the drawing. For example, an adhesive layer may beprovided. Card 1600 may be a closed system that prohibits ingress of anysubstance (e.g. gas or liquid) from outside of the card and egress ofany substance (e.g., gas) to the environment outside the card.

User interface 1620 and bladder 1640 may be fluidically coupled viaconduit 1642. When user interface 1620 is depressed, gas displaced bythe depression may be routed to bladder 1640 via conduit 1642. Conduit1642 may be any suitable structure or channel operative to channel gas.For example, conduit 1642 may be etched into board 1610. As anotherexample, conduit 1642 may be a channel existing in board 1610. Thechannel may cut through the entire thickness of board 1610, however,support structure 1650 may provide the seal closes the channel, andthereby forms conduit 1642. As another example, conduit 1642 may be achannel existing within a layer of material (not shown) residing onboard 1610. Yet another example, conduit 1642 may be a via or a tube.

Bladder 1640 may be any suitable structure operative to receive gas. Forexample, bladder 1640 may be a cavity. The cavity may be constructedduring a lamination process. As another example, bladder 1640 may beanother user interface. As yet another example, bladder 1640 may be afalse user interface (i.e., a structure set up to potentially receive auser interface, but the user interface is not provided).

FIG. 17 shows an illustrative cross-sectional view of assembly 1700.Assembly 1700 can include board 1710, multi-tier step structure 1716,dual-layer user interfaces 1720, material 1730, and structural support1740. Conduit 1718 is provided within multi-tier step structure 1716 andfluidically couples both user interfaces 1720. Thus, one of userinterfaces 1720 may serve as a bladder for the other user interface 1720during an input event. Although only two user interfaces are shownfluidically coupled to each other, it is understood that every userinterface may be fluidically coupled to each other.

FIG. 18 shows an illustrative cross-sectional view of assembly 1800.Assembly 1800 can include board 1810, multi-tier step structure 1816,dual-layer user interface 1820, material 1830, structural support 1840,and bladder 1850. Multi-tier step structure 1816 may have bottom and toptiers. The top tier of structure 1816 may cover bladder 1850, and thebottom tier may abut bladder 1850. Conduit 1818 is provided withinmulti-tier step structure 1816 and fluidically couples user interface1820 and bladder 1850. The size of bladder 1850 may be sized toaccommodate gas displacement from one or more user interfaces. Forexample, in some embodiments, two or more user interfaces may bedepressed simultaneously during an input event.

FIG. 19 shows an illustrative cross-sectional view of assembly 1900.Assembly 1900 can include board 1910, step structure 1916, userinterface 1920, material 1930, structural support 1940, bladder 1950,and conduit 1952, which fluidically couples user interface 1920 tobladder 1950. Bladder 1950 may be contained within structural support1940. Structural support 1940 may be constructed to have a cavity, andwhen it is attached to the underside of board 1910, bladder 1950 isprovided. In another approach, structural support 1940 may beconstructed to have a through-hole, and when it is attached to board1910 and its bottom side is covered, for example, with a laminatematerial, bladder 1950 may be provided.

In some embodiments, each user interface may be associated with its ownbladder. In another embodiment, a common bladder may be shared among alluser interfaces.

FIG. 20 shows illustrative steps for making an assembly or a card.Beginning with step 2010, a board is provided. The board may be aflexible printed circuit board. At step 2020, at least one userinterface is mounted to the board. The user interface can be a singlelayer or a dual layer user interface. At step 2030, a material may bedisposed adjacent to the at least one user interface. The degree towhich the material covers each user interface may vary. For example, theuser interface may be completely covered or partially covered. At step2040, a support structure may be mounted to the board.

The order of the steps presented in FIG. 20 are merely illustrative andmay be performed in any suitable order. For example, the supportstructure may be mounted to the board prior to the at least one userinterface. In addition, additional steps may be added, and steps may beomitted. For example, the structural support mounting step may beomitted. An additional step of placing an adhesive over the board, userinterface, and material may be provided to hold the assembly together.

After the assembly is created, it may be used as a component orsub-assembly in a card. A card assembler may use the assembly to providea pre-lamination card package. The pre-lamination card package mayinclude all the components of a card (e.g., such as the components shownand discussed in connection with FIG. 1). It is understood that thepre-lamination card package may be assembled with or without theassembly. If desired, the components of the assembly may be assembleddirectly into a card package.

The pre-lamination card package may be laminated in a laminationprocess. The lamination process may be any suitable lamination process.The process can result in a card having the pre-lamination card packageand an encapsulating material sandwiched between layers of material(e.g., a polymer sheet). For example, a reaction in mold laminationprocess may be used. One variant of such a process can include acontinuous roll lamination process, an example of which is described inU.S. provisional patent application No. 61/234,406, filed Aug. 17, 2009,which is incorporated by reference herein in its entirety. Anothervariant can include a batch process roll lamination process.

FIG. 21 is an illustrative block diagram of a system 2100 according toan embodiment of the invention. System 2100 can include any combinationof the subsystems, the selective combination of which can operate inconcert to produce laminated cards having buttons or assemblies forincorporation into cards. System 2100 can include user interfaceapplicator 2105 (e.g., for applying one or more user interfaces to aboard), material applicator 2110 (e.g., for applying a material to atleast a portion of a user interface), structural support applicator2115, one or more pre-processing stations 2120 (e.g., for assemblingpre-lamination card packages), lamination system 2130 (e.g., forlaminating a pre-lamination card package), and control system 2140.Control system 2140 may serve as a master control system that controlsand monitors the operation of one or more or all subsystems. Somesubsystems such as, for example, pre-processing stations 2120 andlamination system 2130 may include their own respective control systemsto perform their respective operations, but may coordinate operationswith other subsystems by communicating via control system 2130 ordirectly with each other.

Control system 2140 may communicate with the various subsystems usingcommunications paths 2150. Communications paths 2150 may bebi-directional communications paths. Communications paths 2150 may alsoenable subsystem to subsystem communications.

System 2100 may be split up and performed at different facilities. Forexample, lamination system 2130 and pre-processing system 2120 may beoperated in their own respective facilities apart from the othersubsystems shown in FIG. 21.

Persons skilled in the art will also appreciate that the presentinvention is not limited to only the embodiments described. Personsskilled in the art will also appreciate that the apparatus of thepresent invention may be implemented in other ways than those describedherein. All such modifications are within the scope of the presentinvention, which is limited only by the claims that follow.

What is claimed is:
 1. A laminated card comprising: a flexible circuitboard including electrical contacts; a first user interface elementmounted to the flexible circuit board, the first user interface elementhaving a portion operative to engage one of the electrical contactsduring an input event; and a second user interface element mounted abovethe first user interface element, the second user interface elementhaving a portion operative to engage a surface of the first userinterface element during the input event.
 2. The card of claim 1,wherein a separation gap exists between the portion of the second userinterface element and the surface of the first user interface elementduring times other than the input event.
 3. The card of claim 1, whereinthe first user interface element is a dome switch.
 4. The card of claim1, wherein the second user interface element is a dome switch.
 5. Thecard of claim 1, wherein the first user interface element comprises aforce concentration structure.
 6. The card of claim 5, wherein the forceconcentration structure comprises a round shape, a wedge shape, or apointed shape.
 7. The card of claim 1, wherein the second user interfaceelement comprises a force concentration structure.
 8. The card of claim7, wherein the force concentration structure comprises a round shape, awedge shape, or a pointed shape.
 9. The card of claim 1, furthercomprising a top exterior layer, a laminate material, and a bottomexterior layer, wherein the laminate material, the flexible circuitboard, and first and second user interface elements exist between thetop and bottom exterior layers.
 10. The card of claim 1, furthercomprising a dynamic magnetic stripe communications device.
 11. The cardof claim 1, further comprising: a battery; and a processor.
 12. The cardof claim 1, further comprising: a display.
 13. The card of claim 1,wherein the second user interface element is mounted directly to theflexible circuit board.
 14. The card of claim 1, further comprising: astep structure adhered to the flexible circuit board, wherein the seconduser interface element is mounted to the step structure.
 15. The card ofclaim 1, further comprising: a multi-tier step structure including abottom tier and a top tier, wherein the second user interface element ismounted to the top tier.
 16. The card of claim 1, wherein at least aportion of the first user interface element is permanently coupled toone of the electrical contacts.
 17. The card of claim 1, wherein thefirst and second user interface elements form a first dual-layer userinterface, the card further comprising a second dual-layer userinterface.
 18. An assembly for use in a laminated card comprising alamination material, the assembly comprising: a flexible printed circuitboard; at least one user interface mounted to the flexible printedcircuit board; and at least one bladder structure in fluidiccommunication with the at least one user interface, wherein the at leastone user interface is a distance apart from the at least one bladderstructure.
 19. The assembly of claim 18, wherein the at least onebladder structure is a false user interface.
 20. The assembly of claim18, wherein the at least one bladder structure includes at least aportion of the support structure fixed to the flexible printed circuitboard.
 21. The assembly of claim 18, further comprising a conduit forfluidically connecting the at least one user interface and the at leastone bladder structure.
 22. The assembly of claim 18, further comprisinga dynamic magnetic stripe communications device.
 23. The assembly ofclaim 18, further comprising: a battery; and a processor.
 24. Theassembly of claim 18, further comprising: a display.
 25. The assembly ofclaim 18, further comprising: a top exterior layer; a laminate material;and a bottom exterior layer, wherein the laminate material, flexibleprinted circuit board, the at least one user interface, and the at leastone bladder structure exist between the top and bottom exterior layers.26. A method comprising: providing a flexible printed circuit board;mounting at least one first user interface to the flexible printedcircuit board; and fluidically coupling the at least one first userinterface to at least one second user interface, wherein the at leastone first user interface is not between the at least one second userinterface and the flexible printed circuit board, and the at least onesecond user interface is not between the at least one first userinterface and the flexible printed circuit board.
 27. The method ofclaim 26, further comprising: laminating the flexible printed circuitboard, the at least one first user interface, and the at least onesecond user interface between top and bottom exterior layers.